US Patent Issued to SEMIGHT INSTRUMENTS on Feb. 10 for "Chip testing device and package testing machine" (Chinese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,546,815, issued on Feb. 10, was assigned to SEMIGHT INSTRUMENTS Co. LTD (Suzhou, China).

"Chip testing device and package testing machine" was invented by Zhe Lian (Suzhou, China), Jianjun Huang (Suzhou, China), Yonghong Wu (Suzhou, China), Shan Zhao (Suzhou, China) and Haiyang Hu (Suzhou, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Chip testing device and package testing machine are provided. The chip testing device includes an upper base and a lower base, the upper base being above the lower base and being pressed against the lower base, and a top of the lower base featuring a first mounting part for mounting a test chip and a second mounting...