US Patent Issued to Semiconductor Manufacturing International (Shanghai), Semiconductor Manufacturing International (Beijing) on April 15 for "Semiconductor structure and fabrication method" (Chinese Inventor)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,148, issued on April 15, was assigned to Semiconductor Manufacturing International (Shanghai) Corp. (Shanghai) and Semiconductor Manufacturing International (Beijing) Corp. (Beijing).

"Semiconductor structure and fabrication method" was invented by Zhen Yu Liu (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor structures is provided. The semiconductor structure includes a semiconductor substrate having a first region and a second region. A surface of the first region of the semiconductor substrate contains a gate structure, a surface of the second region of the semiconductor substrate contains a dummy gate structure, and the semic...