US Patent Issued to Semiconductor Energy Laboratory on April 29 for "Semiconductor device and method of manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,289,878, issued on April 29, was assigned to Semiconductor Energy Laboratory Co. Ltd. (Atsugi, Japan).

"Semiconductor device and method of manufacturing semiconductor device" was invented by Tatsuya Onuki (Atsugi, Japan), Takanori Matsuzaki (Atsugi, Japan) and Shunpei Yamazaki (Setagaya, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device that can be miniaturized or highly integrated can be provided. The semiconductor device includes a first conductor positioned over a substrate; an oxide positioned in contact with atop surface of the first conductor; a second conductor, a third conductor, and a fourth conductor positioned over th...