US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on Sept. 9 for "Substrate structures and methods of manufacture" (American, Japanese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,414,238, issued on Sept. 9, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Substrate structures and methods of manufacture" was invented by Yusheng Lin (Phoenix) and Sadamichi Takakusaki (Ota, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A power electronic substrate includes a metallic baseplate having a first and second surface opposing each other. An electrically insulative layer also has first and second surfaces opposing each other, its first surface coupled to the second surface of the metallic baseplate. A plurality of metallic traces each include first and second surfaces opposing each other, their first su...