US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on Sept. 30 for "Semiconductor package electrical contacts and related methods" (Japanese, American Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,359, issued on Sept. 30, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Semiconductor package electrical contacts and related methods" was invented by Yusheng Lin (Phoenix), Michael J. Seddon (Gilbert, Ariz.), Francis J. Carney (Mesa, Ariz.), Takashi Noma (Ota, Japan) and Eiji Kurose (Oizumi-machi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations of a semiconductor package may include a semiconductor die including a first side and a second side, the first side of the semiconductor die including one or more electrical contacts; and an organic material covering at least the first side of the semicond...