US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on Sept. 30 for "Power module package" (South Korean, Singaporean, Chinese, German Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. D1,095,474, issued on Sept. 30, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Power module package" was invented by Seungwon Im (Bucheon, South Korea), JeongHyuk Park (Incheon, South Korea), Keunhyuk Lee (Suzhou, China), Jerome Teysseyre (Singapore) and Paolo Bilardo (Munich).

The patent was filed on April 9, 2025, under Application No. D/997,705.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=D1095474&OS=D1095474&RS=D1095474

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