US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on Sept. 23 for "Leadless semiconductor packages, leadframes therefor, and methods of making" (Malaysian, American Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,522, issued on Sept. 23, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Leadless semiconductor packages, leadframes therefor, and methods of making" was invented by Darrell D. Truhitte (Phoenix), Soon Wei Wang (Seremban, Malaysia) and Chee Hiong Chew (Seremban, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "A leadframe includes a frame, a die pad, a contact including a flank adjacent to the frame, a first tie bar between the frame and die pad, and a second tie bar between the die pad and contact. The leadframe is disposed over a carrier. A semiconductor die is disposed over the die pad. An encapsulant is depo...