US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on Sept. 16 for "Structure and method related to a power module using a hybrid spacer" (Maine, Arizona Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,957, issued on Sept. 16, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Structure and method related to a power module using a hybrid spacer" was invented by Liangbiao Chen (Scarborough, Maine), Yong Liu (Cumberland Foreside, Maine), Tzu-Hsuan Cheng (Scarborough, Maine), Stephen St. Germain (Gilbert, Ariz.) and Roger Arbuthnot (Mesa, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In at least one aspect, a method can include shaping a block of flexible spacer material. The method can include shaping a portion of the block of flexible spacer material to receive a solid metal block. The method can include coupling ...