US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on Sept. 16 for "Semiconductor packages using package in package systems and related methods" (South Korean, Singaporean, Philippine, German Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,999, issued on Sept. 16, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Semiconductor packages using package in package systems and related methods" was invented by Inpil Yoo (Unterhaching, Germany), Maria Cristina Estacio (Lapulapu, Philippines), Jerome Teysseyre (Singapore), Seungwon Im (Bucheon, South Korea) and Jooyang Eom (Gimpo-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations of a semiconductor package may include two or more die, each of the two more die coupled to a metal layer at a drain of each of the two more die, the two or more die and each metal layer arranged in two paralle...