US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on Oct. 14 for "Silicon-on-insulator die support structures and related methods" (Malaysian, American, Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,609, issued on Oct. 14, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Silicon-on-insulator die support structures and related methods" was invented by Michael J. Seddon (Gilbert, Ariz.), Francis J. Carney (Mesa, Ariz.), Eiji Kurose (Oizumi-machi, Japan), Chee Hiong Chew (Seremban, Malaysia) and Soon Wei Wang (Seremban, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations of a silicon-in-insulator (SOI) semiconductor die may include a first largest planar surface, a second largest planar surface and a thickness between the first largest planar surface and the second largest planar surface; and one of...