US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on Nov. 4 for "SiC MOSFET semiconductor packages and related methods" (Philippine, American Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,103, issued on Nov. 4, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"SiC MOSFET semiconductor packages and related methods" was invented by Maria Cristina Estacio (Lapulapu, Philippines), Jerome Teysseyre (Scottsdale, Ariz.) and Elsie Agdon Cabahug (Consolacion, Philippines).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package is disclosed. Specific implementations of a semiconductor package may include: one or more semiconductor die coupled between a baseframe and a clip, the baseframe including a gate pad of the baseframe coupled with a gate pad of the one or more semiconductor die, and a source pad ...