US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on Nov. 4 for "Multi-chip system-in-package" (American, Japanese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,123, issued on Nov. 4, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Multi-chip system-in-package" was invented by Yusheng Lin (Phoenix) and Takashi Noma (Ota, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A system-in-package includes an interposer substrate having a first side and a second side opposite the first side, and a redistribution layer disposed on the first side. The redistribution layer includes a plurality of contact pads and a plurality of interconnections disposed on the first side. The plurality of interconnections is electrically connected to a plurality of terminals disposed on the second side ...