ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,459,082, issued on Nov. 4, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).
"Adjustable clamp finger design" was invented by Sen Sun (Suzhou, China), Kun Feng (Shanghai), Hu Cheng (Suzhou, China) and Naima Wang (Wuzhong District, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations of a clamp finger may include a first portion including at least one tip configured to clamp a substrate against an anvil during a bonding operation; and a second portion including a first opening therethrough configured to permit coupling of the second portion with a clamping bridge. The first portion may be slidably coupled with th...