US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on Nov. 18 for "Transfer molded power modules and methods of manufacture" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,397, issued on Nov. 18, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Transfer molded power modules and methods of manufacture" was invented by Seungwon Im (Bucheon, South Korea), Oseob Jeon (Seoul, South Korea), Dongwook Kang (Bucheon, South Korea), Youngsun Ko (Incheon, South Korea), Jeungdae Kim (Gimpo, South Korea), Changsun Yun (Seoul, South Korea) and Jihwan Kim (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a general aspect, an electronic device assembly includes a substrate arranged in a plane. The substrate has a first side and a second side, the second side being opposite the first sid...