US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on Nov. 18 for "Curved semiconductor die systems and related methods" (Arizona Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,132, issued on Nov. 18, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Curved semiconductor die systems and related methods" was invented by Michael J. Seddon (Gilbert, Ariz.) and Francis J. Carney (Mesa, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations of a curved die system may include a semiconductor die; and a die curvature support structure including an organic material coupled to a surface of the semiconductor die. The die curvature support structure may induce warpage greater than 200 microns in the surface of the semiconductor die. The die curvature support structure may be configured to ind...