US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on Nov. 11 for "Semiconductor package electrical contact structures and related methods" (Japanese, American Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,469,709, issued on Nov. 11, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Semiconductor package electrical contact structures and related methods" was invented by Francis J. Carney (Mesa, Ariz.), Michael J. Seddon (Gilbert, Ariz.), Yusheng Lin (Phoenix), Takashi Noma (Ota, Japan) and Eiji Kurose (Oizumi-machi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations of a semiconductor package may include a die; a first pad and a second pad, the first pad and the second pad each including a first layer and a second layer where the second layer may be thicker than the first layer. At least a first conductor may ...