US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on Nov. 11 for "Semiconductor device modules" (South Korean, American Inventors)

ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,471,204, issued on Nov. 11, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Semiconductor device modules" was invented by Oseob Jeon (Seoul, South Korea), Seungwon Im (Bucheon, South Korea), Roveendra Paul (Dublin, Calif.) and Jerome Teysseyre (Scottsdale, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In general aspect, a module can include a substrate having a semiconductor circuit implemented thereon, and a negative power supply terminal electrically coupled with the semiconductor circuit via the substrate. The negative power supply terminal includes a connection tab arranged in a first plane. The module also inclu...