US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on May 6 for "High power module package structures" (Singaporean, American Inventors)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,955, issued on May 6, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"High power module package structures" was invented by Yusheng Lin (Phoenix) and Jerome Teysseyre (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a general aspect, a package includes a semiconductor die disposed between a first high voltage isolation carrier and a second high voltage isolation carrier. The semiconductor die is thermally coupled to the first high voltage isolation carrier. The package also includes a molding material disposed in a space between the semiconductor die and the first high voltage isolation carrier, and a conduc...