US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on May 27 for "Semiconductor device package assemblies with direct leadframe attachment" (South Korean Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,826, issued on May 27, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Semiconductor device package assemblies with direct leadframe attachment" was invented by Seungwon Im (Bucheon, South Korea) and Oseob Jeon (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "In general aspect, a semiconductor device package can include a substrate and a semiconductor die disposed on and coupled with the substrate. The semiconductor device package can further include a leadframe having an indentation defined therein, at least a portion of the indentation being disposed on and coupled with the semiconductor die via a co...