ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,628, issued on May 27, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).
"Image sensor package" was invented by Yu-Te Hsieh (Taoyuan, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes disposing a first die on a first die-receiving surface in a first cavity at a first vertical height in a substrate and disposing a second die on a second die-receiving surface in a second cavity at a second vertical height in the substrate. The second cavity has an open top, and the second vertical height is greater than the first vertical height in the substrate."
The patent was filed on April 20, 2022, under Applicati...