US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on May 27 for "Backside metal patterning die singulation systems and related methods" (Arizona Inventor)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,765, issued on May 27, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Backside metal patterning die singulation systems and related methods" was invented by Michael J. Seddon (Gilbert, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations of die singulation systems and related methods may include forming a plurality of die on a first side of a substrate, forming a seed layer on a second side of a substrate opposite the first side of the substrate, using a shadow mask, applying a mask layer over the seed layer, forming a backside metal layer over the seed layer, removing the mask layer, and singulating th...