ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,297, issued on May 20, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).
"Semiconductor package system and related methods" was invented by Yushuang Yao (Seremban, Malaysia), Chee Chew (Seremban, Malaysia) and Atapol Prajuckamol (Rayong, Thailand).
According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations of a semiconductor package may include: a substrate, a case coupled to the substrate and a plurality of press-fit pins. The press-fit pins are molded into and fixedly coupled with the case. The pins are also electrically and mechanically coupled to the substrate."
The patent was filed on April 22, 2022, under Applicat...