US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on May 20 for "Power module package for direct cooling multiple power modules" (South Korean, Singaporean, German Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,364, issued on May 20, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Power module package for direct cooling multiple power modules" was invented by Jerome Teysseyre (Singapore), Inpil Yoo (Unterhaching, Germany) and Jooyang Eom (Gimpo-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to an aspect, a power module package includes a plurality of power modules including a first power module and a second power module, a plurality of heat sinks including a first heat sink coupled to the first power module and a second heat sink coupled to the second power module, and a module carrier coupled to the ...