US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on May 13 for "Substrates and related methods" (Malaysian, Chinese, Thai Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,558, issued on May 13, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Substrates and related methods" was invented by Atapol Prajuckamol (Thanyaburi, Thailand), Chee Hiong Chew (Seremban, Malaysia), Yushuang Yao (Shenzhen, China) and Vemmond Jeng Hung Ng (Senawang, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations of a substrate may include an electrically insulative layer having a first largest planar side and a second largest planar side opposing the first largest planar side; a first electrically conductive layer coupled to the first largest planar side and including a first scalloped edge havi...