US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on May 13 for "Gapless image sensor packages and related methods" (Idaho Inventor)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,708, issued on May 13, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Gapless image sensor packages and related methods" was invented by Swarnal Borthakur (Boise, Idaho).

According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations of image sensor packages may include: an image sensor die including a first largest planar side and a second largest planar side; an optically transmissive cover including a first largest planar side and a second largest planar side where the second largest planar side coupled to the first largest planar side of the image sensor die using an adhesive; and a light block material that fully co...