US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on May 13 for "Dual cool power module with stress buffer layer" (South Korean, Chinese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,689, issued on May 13, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Dual cool power module with stress buffer layer" was invented by Jonghwan Baek (Bucheon, South Korea), JeongHyuk Park (Incheon, South Korea), Seungwon Im (Seoul, South Korea) and Keunhyuk Lee (Suzhou, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Described implementations provide wireless, surface mounting of at least two semiconductor die on die attach pads (DAPs) of the semiconductor package, where the at least two semiconductor die are electrically connected by a clip. A stress buffer layer may be provided on the clip, and a heatsink may be...