US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on May 13 for "Concealed gate terminal semiconductor packages and related methods" (Philippine Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,583, issued on May 13, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Concealed gate terminal semiconductor packages and related methods" was invented by Erwin Ian Vamenta Almagro (Lapu-Lapu, Philippines), Maria Clemens Ypil Quinones (Cebu, Philippines), Romel N. Manatad (Liloan, Philippines), Maria Cristina Estacio (Lapu-Lapu, Philippines) and Elsie Agdon Cabahug (Consolacion, Philippines).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor packages may include a lead frame, one or more semiconductor die coupled with the lead frame, and an interposer coupled with the lead frame and with at least one of the one...