US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on March 25 for "Fan-out wafer level packaging of semiconductor devices" (American, Japanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,084, issued on March 25, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Fan-out wafer level packaging of semiconductor devices" was invented by George Chang (Tempe, Ariz.), Yusheng Lin (Phoenix), Gordon M. Grivna (Mesa, Ariz.) and Takashi Noma (Ota, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a general aspect, a fan-out wafer level package (FOWLP) can include a semiconductor die having an active surface, a backside surface, a plurality of side surfaces, each side surface of the plurality of side surfaces extending between the active surface and the backside surface, a plurality of conductive bumps disposed...