US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on March 18 for "Semiconductor packages with an intermetallic layer" (Arizona Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,167, issued on March 18, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Semiconductor packages with an intermetallic layer" was invented by Michael J. Seddon (Gilbert, Ariz.) and Francis J. Carney (Mesa, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a semiconductor package. Implementations include forming on a die backside an intermediate metal layer having multiple sublayers, each including a metal selected from the group consisting of titanium, nickel, copper, silver, and combinations thereof. A tin layer is deposited onto the intermediate metal layer and is then reflowed with a silver lay...