US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on March 18 for "Jet impingement cooling with bypass fluid portion for high power semiconductor devices" (Arizona Inventor)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,124, issued on March 18, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Jet impingement cooling with bypass fluid portion for high power semiconductor devices" was invented by John Mookken (Scottsdale, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A jet impingement cooling assembly for semiconductor devices includes an inlet chamber configured to receive an inlet fluid flow, and a jet plate having a plurality of jet nozzles formed therein and coupled to the inlet chamber, and positioned to direct a jet fluid portion of the inlet fluid flow from the inlet chamber through the jet nozzles. The jet impingement cool...