US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on June 3 for "Substrate alignment systems and related methods" (American, Japanese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,632, issued on June 3, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Substrate alignment systems and related methods" was invented by Michael J. Seddon (Gilbert, Ariz.) and Takashi Noma (Ota, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations of a method of making a plurality of alignment marks on a wafer may include: providing a wafer including an alignment feature on a first side of the wafer. The method may include aligning the wafer using a camera focused on the first side of the wafer. The wafer may be aligned using the alignment feature on the first side of the die. The wafer may also include cr...