US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on June 24 for "Multi-faced molded semiconductor package and related methods" (Japanese Inventor)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,014, issued on June 24, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Multi-faced molded semiconductor package and related methods" was invented by Eiji Kurose (Oizumi-machi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations of a method of forming a semiconductor package may include forming electrical contacts on a first side of a wafer, applying a photoresist layer to the first side of the wafer, patterning the photoresist layer, and etching notches into the first side of the wafer using the photoresist layer. The method may include applying a first mold compound into the notches and over the first...