US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on June 24 for "Image sensor with hybrid binning" (American, Slovene, Slovenian Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,342,090, issued on June 24, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Image sensor with hybrid binning" was invented by Kai Yau Mok (Cupertino, Calif.) and Marko Mlinar (Horjul, Slovenia).

According to the abstract* released by the U.S. Patent & Trademark Office: "An image sensor may perform hybrid pixel binning. In pixel binning, pixel values from multiple pixels are combined into a single representative binning value. In a hybrid pixel binning scheme, different pixel groups may be binned in different ways in a single image sensor. When the range of values in a pixel group is low (indicating a flat surface), a mean or median binning scheme may be ...