US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on June 24 for "Backside metal patterning die singulation system and related methods" (Arizona Inventor)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,069, issued on June 24, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Backside metal patterning die singulation system and related methods" was invented by Michael J. Seddon (Gilbert, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations of methods of singulating a plurality of die included in a substrate may include forming a plurality of die on a first side of a substrate, forming a backside metal layer on a second side of a substrate, applying a photoresist layer over the backside metal layer, patterning the photoresist layer along a die street of the substrate, and etching through the backside metal...