ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,917, issued on July 8, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).
"Singulation systems and related methods" was invented by Michael J. Seddon (Gilbert, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations of a semiconductor substrate singulation process may include applying a fluid jet to a material of a die street of a plurality of die streets included in a semiconductor substrate where the semiconductor substrate may include: a plurality of die separated by the plurality of die streets; and a plurality of die support structures coupled thereto; and singulating the plurality of die and the plurality ...