US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on July 29 for "Semiconductor packages with die including cavities and related methods" (Malaysian, American, Japanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,554, issued on July 29, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Semiconductor packages with die including cavities and related methods" was invented by Michael J. Seddon (Gilbert, Ariz.), Francis J. Carney (Mesa, Ariz.), Chee Hiong Chew (Seremban, Malaysia), Soon Wei Wang (Seremban, Malaysia) and Eiji Kurose (Oizumi-machi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations of a method of forming a semiconductor package may include forming a plurality of notches into the first side of a semiconductor substrate; forming an organic material over the first side of the semiconductor substrate and in...