US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on July 29 for "Die sidewall coatings and related methods" (Malaysian, American, Japanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,555, issued on July 29, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Die sidewall coatings and related methods" was invented by Francis J. Carney (Mesa, Ariz.), Yusheng Lin (Phoenix), Michael J. Seddon (Gilbert, Ariz.), Chee Hiong Chew (Seremban, Malaysia), Soon Wei Wang (Seremban, Malaysia) and Eiji Kurose (Chuo, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various implementations of a method of forming a semiconductor package may include forming a plurality of notches into the first side of a semiconductor substrate; applying a permanent coating material into the plurality of notches; forming a first organi...