ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,813, issued on July 1, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Semiconductor package and related methods" was invented by Chee Hiong Chew (Seremban, Malaysia), Erik Nino Tolentino (Seremban, Malaysia), Vemmond Jeng Hung Ng (Senawang, Malaysia) and Shutesh Krishnan (Seremban, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations of semiconductor packages may include one or more die coupled over a substrate, an electrically conductive spacer coupled over the substrate, and a clip coupled over and to the one or more die and the electrically conductive spacer. The clip may electrically couple the on...