ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,755, issued on July 1, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Low stress asymmetric dual side module" was invented by Chee Hiong Chew (Seremban, Malaysia), Atapol Prajuckamol (Thanyaburi, Thailand), Stephen St. Germain (Gilbert, Ariz.) and Yusheng Lin (Phoenix).

According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations of semiconductor packages may include a first substrate having two or more die coupled to a first side, a clip coupled to each of the two or more die on the first substrate and a second substrate having two or more die coupled to a first side of the second substrate. A clip may be coupled to ea...