ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,211,771, issued on Jan. 28, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).
"Power module and related methods" was invented by Jonghwan Baek (Bucheon, South Korea), Jeonghyuk Park (Incheon, South Korea), Seungwon Im (Seoul, South Korea) and Keunhyuk Lee (Suzhou, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations of semiconductor packages may include a substrate, a first die coupled on the substrate, and a lead frame coupled over the substrate. The lead frame may include a die attach pad. Implementations of semiconductor packages may also include a second die coupled on the die attach pad. The second die may...