US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on Jan. 27 for "Semiconductor packages with wettable flanks and related methods" (Malaysian Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,812, issued on Jan. 27, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Semiconductor packages with wettable flanks and related methods" was invented by Hui Min Ler (Seremban, Malaysia), Swee Har Khor (Kuala Lumpur, Malaysia), Ziming Chang (Tampin, Malaysia), Kok Yang Lau (Asahan, Malaysia) and Heng Giap Ong (Seremban, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations of a method of providing wettable flanks on leads of a semiconductor package may include applying mold compound around a plurality of leads included in a leadframe; electroplating exposed portions of the plurality of leads; cutting at...