US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on Jan. 13 for "Semiconductor package with guide pin" (Chinese, Malaysian, Thai Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,519, issued on Jan. 13, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Semiconductor package with guide pin" was invented by Chee Hiong Chew (Seremban, Malaysia), Yushuang Yao (Shenzhen, China), Atapol Prajuckamol (Thanyaburi, Thailand) and Chuncao Niu (Wuhan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor guide pin is disclosed. Specific implementations may include a heatsink, one or more substrates coupled together, one or more pressfit pins coupled to the one or more substrates, and two or more guide pins coupled to the one or more substrates, where the two or more guide pins may have a height ...