US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on Feb. 3 for "Dual side cooled power module with three-dimensional direct bonded metal substrates" (Maine, Arizona Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,579, issued on Feb. 3, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Dual side cooled power module with three-dimensional direct bonded metal substrates" was invented by Yong Liu (Cumberland Foreside, Maine), Yusheng Lin (Phoenix) and Jerome Teysseyre (Scottsdale, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate includes a ceramic tile and a three-dimensional (3D) conductive structure. The 3D conductive structure includes a planar base layer having a bottom surface bonded to a top surface of the ceramic tile, and a block disposed above the planar base layer. The block is monolithically integrated with t...