US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on Feb. 18 for "Semiconductor device and method of forming micro interconnect structures" (Arizona Inventors)

ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,230,559, issued on Feb. 18, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Semiconductor device and method of forming micro interconnect structures" was invented by Francis J. Carney (Mesa, Ariz.), Jefferson W. Hall (Chandler, Ariz.) and Michael J. Seddon (Gilbert, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device has a first semiconductor die and second semiconductor die with a conductive layer formed over the first semiconductor die and second semiconductor die. The second semiconductor die is disposed adjacent to the first semiconductor die with a side surface and the conductive layer of the fi...