US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on Feb. 18 for "Immersion direct cooling modules" (South Korean, American Inventors)

ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,230,551, issued on Feb. 18, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Immersion direct cooling modules" was invented by Oseob Jeon (Seoul, South Korea), Youngsun Ko (Incheon, South Korea), Seungwon Im (Seoul, South Korea), Jerome Teysseyre (Scottsdale, Ariz.) and Michael J. Seddon (Gilbert, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations of a semiconductor package may include one or more semiconductor die directly coupled to only a direct leadframe attach (DLA) leadframe including two or more leads; and a coating covering the one or more semiconductor die and the DLA leadframe where when the semic...