US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on Feb. 18 for "High power module package structures" (South Korean, German Inventors)

ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,230,601, issued on Feb. 18, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"High power module package structures" was invented by Seungwon Im (Seoul, South Korea), JooYang Eom (Gimpo-si, South Korea), Inpil Yoo (Unterhaching, Germany) and Oseob Jeon (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes disposing a first direct bonded metal (DBM) substrate substantially parallel to a second DBM substrate a distance apart to enclose a space. The method further includes disposing at least a semiconductor die in the space, and bonding the semiconductor die to the first DBM substrate using a first ...