US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on Feb. 18 for "Die cleaning systems and related methods" (Arizona Inventor)

ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,230,543, issued on Feb. 18, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Die cleaning systems and related methods" was invented by Michael J. Seddon (Gilbert, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Implementations of methods of forming a plurality of semiconductor die may include forming a damage layer beneath a surface of a die street in a semiconductor substrate, singulating the semiconductor substrate along the die street into a plurality of semiconductor die, and removing one or more particulates in the die street after singulating through applying sonic energy to the plurality of semiconductor die."

T...