US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on Dec. 30 for "Power module" (Chinese, Malaysian, American Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,513,870, issued on Dec. 30, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Power module" was invented by Yushuang Yao (Shenzhen, China), Chee Hiong Chew (Seremban, Malaysia), Vemmond Jeng Hung Ng (Senawang, Malaysia), Chuncao Niu (Wuhan, China) and Sravan Vanaparthy (Phoenix).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes attaching a power electronic substrate to a bottom of a frame. The frame has a box-like rectangular shape with an open top and an open bottom. The method further includes disposing an external conductive terminal on the frame. The external conductive terminal has at least one terminal stu...