US Patent Issued to SEMICONDUCTOR COMPONENTS INDUSTRIES on Aug. 26 for "Stacked power terminals in a power electronics module" (Malaysian, Chinese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,402,264, issued on Aug. 26, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.).

"Stacked power terminals in a power electronics module" was invented by Vemmond Jeng Hung Ng (Senawang, Malaysia), Yushuang Yao (Shenzhen, China) and Chee Hiong Chew (Seremban, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "A module includes a power circuit enclosed in a casing. A first power terminal and a second power terminal of the power circuit each extend to an exterior of the casing. The first power terminal and the second power terminal separated by a gap are disposed in a stack on the exterior of the casing."

The patent was filed o...