ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,466, issued on Sept. 23, was assigned to SEMES Co. LTD. (Cheonan-si, South Korea).
"Apparatus for transferring die in bonding equipment and method thereof" was invented by Chang Jin Kim (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for transferring dies in bonding equipment includes an ejector configured to push up a die attached to a dicing tape, an ejector controller controlling the ejector to move up or move down, a gas passage disposed in the ejector and forming a gas channel for applying vacuum pressure or pneumatic pressure, a gas stream controller controlling the vacuum pressure or the pneumatic pressure ...